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一种电力转换电路的封装模块
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摘要:本发明提供了一种电力转换电路的封装模块,本发明利用支撑构件与支撑螺栓的相互配合达到防止DBC陶瓷基板和散热基板的翘曲;在所述DBC陶瓷基板的周缘部不设置导电图案,使得周缘部较薄,可以进一步抑制应力;支撑构件及其支撑螺栓搭建起散热路径,进步增强散热效果;在使用第一焊料焊接所述DBC陶瓷基板和散热基板时,环形凹槽可以防止第一焊料在散热基板的上表面的横向扩散,防止焊料堵塞第一贯通孔,以及防止壳体与所述散热基板的接合。


Abstract: The invention provides a package module of a power conversion circuit so as to achieve a purpose of preventing warping of a DBC ceramic substrate and a radiating substrate through mutual cooperation between a support member and a support bolt. The peripheral portion of the DBC ceramic substrate is not provided with a conductive pattern, so that the peripheral portion is allowed to be thin, which can further suppress stress; the support member and the support bolt construct a heat dissipation path, thereby further enhancing a heat radiation effect; and when the DBC ceramic substrate and the radiating substrate are welded through a first solder, an annular groove can prevent the first solder from diffusing transversely on the upper surface of the radiating substrate, thereby preventing the solder from blocking a first through hole and preventing joint between the housing and the radiating substrate.

专利号
201810221367.4
专利类型
发明专利
申请日
2018-03-17
法律状态
已授权
国家/地区
中国CN
转让费用
45000.00
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